LOCTITE® ABLESTIK ABP 2035SCR
Features and Benefits
This 1-part, non-conductive, snap-cure adhesive is designed for high-throughput die-attach applications. It offers low stress and excellent adhesion between dissimilar surfaces.
LOCTITE® ABLESTIK ABP 2035SCR is a 1-part, red, non-conductive, silica-filled die-attach adhesive paste for high-throughput applications. It is widely used in electronic applications, particularly smartcards, chip modules, and semiconductor packages. It is designed to minimize stress between the die and substrate, especially across materials with mismatched thermal expansion. Its thixotropic nature allows for easy flow dispensing and reduces migration after application. The product cures fast when exposed to heat.
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Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 50.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Above Tg | 135.0 ppm/°C |
| Cure type | Heat cure |
| Glass transition temperature (Tg) | 118.0 °C |
| Thermal conductivity | 0.4 W/mK |
| Thixotropic index | 4.0 |
| Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 9830.0 mPa·s (cP) |
LOCTITE® ABLESTIK ABP 2035SCR
This 1-part, non-conductive, snap-cure adhesive is designed for high-throughput die-attach applications. It offers low stress and excellent adhesion between dissimilar surfaces.