BERGQUIST® HI FLOW THF 1000F-AC
被称为 Hi-Flow® 225F-AC
功能与优点
BERGQUIST HI FLOW THF 1000F-AC, Reinforced, Phase Change Thermal Interface Material
BERGQUIST® HI FLOW® THF 1000F-AC is a high performance, thermal interface material for use between a computer processor and a heat sink. BERGQUIST HI FLOW THF 1000F-AC consists of a soft, thermally conductive 55°C phase change compound coated to the top surface of an aluminum carrier with a soft, thermally conductive adhesive compound coated to the bottom surface to improve adhesion to the heat sink.Above the 55°C phase change temperature, BERGQUIST HI FLOW THF 1000F-AC wets-out the thermal interface surfaces and flows to produce low thermal impedance. BERGQUIST HI FLOW THF 1000F-AC requires pressure from the assembly to cause material flow. The HI-FLOW coatings resist dripping in vertical orientation.The material includes a base carrier liner with differential release properties to facilitate simplicity in roll form packaging and application assembly. Please contact BERGQUIST Product Management for applications that are less than 0.07'' square.
- 可通过手动或自动的方式，点胶至室温下的散热器表面
- 热阻：0.10°C-in2/W（@25 psi）
- 增强基材，表面涂层
文件和下载
寻找另一种语言的TDS或SDS？
技术信息
| 导热性 | 1.0 W/mK |
| 操作温度 | 120.0 °C |
| 标准厚度 | 0.102 mm |
| 相变温度 | 55.0 °C |
| 载体膜厚度 | 0.38 mm |
| 阻燃性 | V-0 |
| 颜色 | 黑色 |
常见问题
如何修改ASTM D5470测试来表征相变热性能？
我应该避免在哪些应用中使用HI-FLOW？
为什么HI-FLOW相变温度是65°C？
优化HI-FLOW材料热性能所需的最小压力是多少？
HI-FLOW会取代机械紧固件吗？
我可以使用HI-FLOW材料的螺丝安装装置吗？
BERGQUIST® HI-FLOW THF 1000F-AC中的粘合剂是否可挪动？
在将粘合剂支持的HI-FLOW应用于吸热部件之前，是否需要进行任何表面处理？
HI-FLOW材料是否可重复使用？
制造业中的易处理是什么意思？
无粘性是什么意思？为什么这很重要？
BERGQUIST® HI FLOW THF 1000F-AC
BERGQUIST HI FLOW THF 1000F-AC, Reinforced, Phase Change Thermal Interface Material