LOCTITE® ABLESTIK FS 849-TI

被称为 ABLEBOND FS849-TI (22G)

功能与优点

LOCTITE ABLESTIK FS 849-TI, Proprietary Hybrid Chemistry, Die Attach, Medium Modulus
LOCTITE® ABLESTIK FS 849-TI is designed for power applications. This material is a medium modulus adhesive suited for a wide variety of die sizes where thermal and electrical conductivity are needed in a high reliability package.
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技术信息

固化方式 热+紫外线
应用 芯片焊接
拉伸模量, @ 250.0 °C 1070.0 N/mm² (155190.0 psi )
热模剪切强度 4.1 kg-f
热膨胀系数 (CTE) 44.0 ppm/°C