LOCTITE® ABLESTIK 8008MD
Known as ABLECOAT 8008MD
Features and Benefits
LOCTITE ABLESTIK 8008MD, Proprietary Hybrid Chemistry, Die Attach
LOCTITE® ABLESTIK 8008MD adhesive is designed for medium die attach applications. This material can be applied to a wafer backside by stencil printing and then B-staged in an oven. The adhesive can then be cured after die attach in an in-line process. This material was originally released as RP-825-3C1.
- Electrically conductive
- Thermally conductive
- Low modulus
- Good substrate wetting
Documents and Downloads
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Technical Information
| Applications | Die attach |
| Cure type | Heat cure |
| Extractable ionic content, Chloride (CI-) | 9.0 ppm |
| Extractable ionic content, Potassium (K+) | 9.0 ppm |
| Extractable ionic content, Sodium (Na+) | 9.0 ppm |
| Hot die shear strength | 2.7 kg-f |
| Storage temperature | -40.0 °C |
| Tensile modulus, DMTA @ 250.0 °C | 440.0 N/mm² (63820.0 psi ) |
LOCTITE® ABLESTIK 8008MD
LOCTITE ABLESTIK 8008MD, Proprietary Hybrid Chemistry, Die Attach