BERGQUIST® GAP PAD® TGP 3000
Conhecido como Gap Pad® 3000S30
Características e Benefícios
This thermally conductive, silicone-based, fiberglass-reinforced gap pad filler has a high thermal conductivity rating of 3.0 W/m-K. Ideal for stress-sensitive applications.
BERGQUIST® GAP PAD TGP 3000 is a pre-cured, silicone based, thermally conductive, reinforced gap pad. It is highly conformable and exhibits thermal resistance and softness. It is fiberglass-reinforced and therefore offers resistance against puncture, shear and tear. This product is well suited for high performance, low stress sensitive applications.
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Documentação Adicional
Informação Técnica
| Capacidade de calor, ASTM E1269 | 1.0 J/g-K |
| Classificação da chama | V-0 |
| Constante dielétrica, ASTM D150 @ 1kHz | 7.0 |
| Cor | Azul-claro |
| Densidade | 3.2 g/cm³ |
| Dureza shore, Thirty second delay value, ASTM D2240 Borracha à granel Shore 00 | 30.0 |
| Espessura padrão | 0.254 - 3.175 mm |
| Resistividade volumétrica | 1×10 Ohm m |
| Temperatura de operação | -60.0 - 200.0 °C |
| Tensão de ruptura dielétrica | 3000.0 Vac |
BERGQUIST® GAP PAD® TGP 3000
This thermally conductive, silicone-based, fiberglass-reinforced gap pad filler has a high thermal conductivity rating of 3.0 W/m-K. Ideal for stress-sensitive applications.