LOCTITE® ABLESTIK 8008HT
Bekend als ABLECOAT 8008HT
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A 1-part, proprietary hybrid chemistry, lead-free, electrically and thermally conductive die-attach adhesive specifically formulated for high power devices in a high UPH environment.
LOCTITE® ABLESTIK 8008HT die-attach adhesive is perfect for high power devices in a high UPH environment. A lead-free alternative to soft solder and eutectic, it can potentially reduce the layers of backside metallization required. It can be applied to a wafer backside by stencil printing, B-staged in an oven, then be cured after die attach in an in-line process exhibiting a consistent, void-free bondline without bleed. Should be used with a pressure sensitive dicing tape. Not compatible with UV dicing tapes.
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Technische informatie
| Afschuifsterkte RT-matrijs, 2 x 2 mm Si die on Cu leadframe | 6.0 kg-f |
| Afschuifsterkte bij hete matrijs, @ 260.0 °C 2 x 2 mm Si die on Cu LF | 2.6 kg-f |
| Coëfficiënt van thermische uitzetting (CTE) | 37.0 ppm/°C |
| Coëfficiënt van thermische uitzetting (CTE), Above Tg | 62.0 ppm/°C |
| Extraheerbare ionische inhoud, Chloride (CI-) | 9.0 ppm |
| Extraheerbare ionische inhoud, Kalium (K+) | 9.0 ppm |
| Extraheerbare ionische inhoud, Natrium (Na+) | 9.0 ppm |
| Glasovergangstemperatuur (Tg) | 264.0 °C |
| Kleur | Zilverkleurig |
| Thermische geleidbaarheid | 11.0 W/mK |
| Thixotrope index | 4.0 |
| Toepassingen | Matrijsmontage |
| Trekmodulus, @ 250.0 °C | 2451.0 N/mm² (355340.0 psi ) |
| Uithardingsschema, Snap Cure @ 170.0 °C | 20.0 sec |
| Uithardingstype | Uitharding door warmte |
| Viscositeit, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 50000.0 mPa.s (cP) |
| Volumeweerstandsvermogen | 0.00005 Ohm cm |
LOCTITE® ABLESTIK 8008HT
A 1-part, proprietary hybrid chemistry, lead-free, electrically and thermally conductive die-attach adhesive specifically formulated for high power devices in a high UPH environment.