LOCTITE® ABLESTIK 2100A
Conocido como ABLEBOND 2100A (34G)
Características y Ventajas
This die attach adhesive is specially designed for Pb-free array packaging and is suitable for die sizes up to 12.7mm x 12.7mm (0.5in x 0.5in).
LOCTITE® ABLESTIK 2100A die attach adhesive is specifically designed for Pb-free array packaging. It is able to withstand the high reflow temperatures necessary for Pb-free solders at 260°C (500°F). It is suitable for die sizes up to 12.7 x 12.7mm (0.5in x 0.5in), has high hot/wet adhesion, ultra-low moisture absorption, and excellent dispensing characteristics.
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Información técnica
| Aplicaciones | Unión |
| Coeficiente de dilatación térmica (CDT) | 65.0 ppm/°C |
| Contenido iónico extraíble, Cloruro (CI-) | 9.0 ppm |
| Contenido iónico extraíble, Potasio (K+) | 9.0 ppm |
| Contenido iónico extraíble, Sodio (Na+) | 9.0 ppm |
| Módulo de tracción, DMTA @ 250.0 °C | 234.0 N/mm² (34000.0 psi ) |
| Módulo de tracción, DMTA @ 65.0 °C | 3172.0 N/mm² (460000.0 psi ) |
| Resistencia al corte a temperatura ambiente | 16.0 kg-f |
| Resistencia al corte con calor | 5.0 kg-f |
| Tipo de curado | Curado Térmico |
LOCTITE® ABLESTIK 2100A
This die attach adhesive is specially designed for Pb-free array packaging and is suitable for die sizes up to 12.7mm x 12.7mm (0.5in x 0.5in).