LOCTITE® ABLESTIK 84-1LMISR4
Features and Benefits
This rigid, electrically conductive, epoxy-based die attach adhesive is perfect for small components assembly.
LOCTITE® ABLESTIK 84-1LMISR4 is one of the most widely used die-attach products in the semiconductor industry. This electrically conductive adhesive is specially formulated for use in high throughput, automated die-attach equipment. You can rely on minimum adhesive dispense and die put down dwell times, minimal tailing and stringing, and a work life up to two weeks for small series assemblies.
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Technical Information
| Application method | Dispense system |
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 40.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Above Tg | 150.0 ppm/°C |
| Colour | Silver |
| Cure schedule, @ 175.0 °C | 1.0 hr. |
| Cure type | Heat cure |
| Extractable ionic content, Chloride (CI-) | 20.0 ppm |
| Extractable ionic content, Potassium (K+) | 10.0 ppm |
| Extractable ionic content, Sodium (Na+) | 10.0 ppm |
| Glass transition temperature (Tg) | 120.0 °C |
| Moisture absorption, 168 hr. @ 85°C/85% RH | 0.6 % |
| Number of components | 1 part |
| Physical form | Paste |
| Recommended for use with | LeadFrame: gold, LeadFrame: silver |
| Tensile modulus, @ 250.0 °C | 300.0 N/mm² (44000.0 psi ) |
| Thermal conductivity | 2.5 W/mK |
| Thixotropic index | 5.6 |
| Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 8000.0 mPa·s (cP) |
| Volume resistivity | ≤ 0.0002 Ohm cm |
LOCTITE® ABLESTIK 84-1LMISR4
This rigid, electrically conductive, epoxy-based die attach adhesive is perfect for small components assembly.