LOCTITE® ABLESTIK 2033SC
Known as ABLEBOND 2033SC (13G)
Features and Benefits
This 1-part, red, non-conductive die-attach adhesive is designed for high throughput smart card bonding applications.
LOCTITE® ABLESTIK 2033SC is a red, proprietary hybrid chemistry-based, non-conductive die-attach adhesive for high-throughput smart card bonding applications. It’s compatible with various encapsulant chemistries. It has a long work life, exhibits minimal resin bleed-out (RBO), and cures fast when exposed to heat.
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Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 56.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Above Tg | 133.0 ppm/°C |
| Cure schedule, Alternate 2 @ 150.0 °C | 10.0 sec. |
| Cure schedule, Alternate @ 120.0 °C | 60.0 sec. |
| Cure schedule, Recommended @ 110.0 °C | 90.0 sec. |
| Cure type | Heat cure |
| Extractable ionic content, Chloride (CI-) | 29.0 ppm |
| Extractable ionic content, Potassium (K+) | 4.0 ppm |
| Extractable ionic content, Sodium (Na+) | 14.0 ppm |
| Glass transition temperature (Tg) | 46.0 °C |
| Key characteristics | Cure speed: fast cure, Stress: low stress |
| Tensile modulus, DMTA @ 200.0 °C | 60.0 N/mm² (8600.0 psi ) |
| Thixotropic index | 6.1 |
| Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 11300.0 mPa·s (cP) |
LOCTITE® ABLESTIK 2033SC
This 1-part, red, non-conductive die-attach adhesive is designed for high throughput smart card bonding applications.